Thin film transistor array substrate and organic light emitting diode panel

ABSTRACT

A thin film transistor (TFT) array substrate and an organic light emitting diode (OLED) panel are provided. The TFT array substrate includes a display area and a non-display area. The non-display area is provided with a plurality of gate traces connected to a control chip, the TFT array substrate includes: a flexible substrate includes a metal jumper-joint sublayer disposed in the non-display area, wherein the metal jumper-joint sublayer is adjacent to the display area; and a thin film transistor is disposed on the flexible substrate, wherein the thin film transistor layer includes a plurality of thin film transistors correspondingly disposed in the display area, and a gate trace of each of the thin film transistors and the gate trace of the non-display area are connected by a jumper joint arrangement through the metal jumper-joint sublayer.

FIELD OF INVENTION

The present disclosure relates to the field of display technologies, andmore particularly, to a thin film transistor (TFT) array substrate andan organic light emitting diode (OLED) panel.

BACKGROUND OF INVENTION

Organic light emitting diodes (OLEDs) have many excellent features suchas self-emission, low energy consumption, wide viewing angles, richcolors, fast response times, and the ability to prepare flexiblescreens. The related designs used in the display have already become themain trend in the field of display technologies. Wherein, reducing thelength of the non-display area of an OLED panel is one of the mainissues.

Technical Problems

In the design of the existing OLED panel, as shown in FIG. 1, scanlines, data lines, and ground lines of a thin film transistor (TFT)array in the display area 2 are respectively connected to a chip on film(COF) by gate traces 3 (including a connecting area 31 and a fan-outarea 32), VDD traces 4, and VSS traces 5. Because the gate traces arelocated in the gate metal layer, and the VDD traces 4 and the VSS traces5 are located in a source/drain layer, the gate traces 3 arejumper-jointed to the source/drain layer at a jumper-joint position 33,i.e. a jumper joint arrangement, to facilitate the subsequent connectionsteps. However, in order to prevent various traces from contacting eachother, the jumper-joint position 33 needs to avoid the positions of theVDD traces 4 and the positions of the VSS traces 5. Thus, the length ofthe lower bezel of the OLED panel cannot be further reduced.

Therefore, it is necessary to provide a thin film transistor (TFT) arraysubstrate and an organic light emitting diode (OLED) panel to solve theproblems of the prior art.

SUMMARY OF INVENTION Technical Solutions

The object of the present disclosure is to provide a thin filmtransistor (TFT) array substrate and an organic light emitting diode(OLED) panel. The present disclosure can avoid the problem of theexisting technology and further reduce the length of lower bezel of theOLED panel, thereby forming an OLED panel with a narrow bezel.

In order to achieve the aforementioned object of the present disclosure,the present disclosure provides an organic light emitting diode (OLED)panel, including:

a thin film transistor (TFT) array substrate including a display areaand a non-display area, wherein the non-display area is provided with aplurality of gate traces connected to a control chip, the TFT arraysubstrate includes a flexible substrate and a thin film transistorlayer, the flexible substrate includes a metal jumper-joint sublayerdisposed in the non-display area, the metal jumper-joint sublayer isadjacent to the display area, the thin film transistor layer is disposedon the flexible substrate, and the thin film transistor layer includes aplurality of thin film transistors correspondingly disposed in thedisplay area, a gate trace of each of the thin film transistors and agate trace of the non-display area are connected by a jumper jointarrangement through the metal jumper-joint sublayer, the flexiblesubstrate includes a first flexible sublayer, an inorganic sublayer, themetal jumper-joint sublayer, and a second flexible sublayer stacked insequence;

a planarization layer is disposed on the thin film transistor layer;

a pixel definition layer is disposed on the planarization layer;

an organic electroluminescent device layer is disposed on the pixeldefinition layer and located in the display area; and

an encapsulation layer is disposed on the organic electroluminescentdevice layer.

According to one embodiment of the present disclosure, the metaljumper-joint sublayer includes a first titanium metal sublayer, analuminum metal sublayer, and a second titanium metal sublayer stacked insequence.

According to one embodiment of the present disclosure, the metaljumper-joint sublayer is correspondingly disposed in a bending area ofthe non-display area.

According to one embodiment of the present disclosure, the secondflexible sublayer is provided with a first through hole and a secondthrough hole, the first through hole is used for connecting the gatetrace of the thin film transistor to the metal jumper-joint sublayer,and the second through hole is used for connecting the gate trace of thenon-display area to the metal jumper-joint sublayer.

According to one embodiment of the present disclosure, the thin filmtransistor layer includes a TFT active area, a gate insulation sublayer,the gate traces, an interlayer dielectric sublayer, and a plurality ofsource/drain traces stacked in sequence, the gate insulation sublayer isprovided with a third through hole at a position corresponding to themetal jumper-joint sublayer, and the third through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer.

According to one embodiment of the present disclosure, the TFT arraysubstrate further includes a buffer layer disposed between the flexiblesubstrate and the thin film transistor layer, the buffer layer isprovided with a fourth through hole at a position corresponding to themetal jumper-joint sublayer, and the fourth through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer.

According to one embodiment of the present disclosure, the encapsulationlayer includes a first inorganic encapsulation layer, an organicencapsulation layer, and a second inorganic encapsulation layer.

The present disclosure further provides a thin film transistor (TFT)array substrate, including a display area and a non-display area,wherein the non-display area is provided with a plurality of gate tracesconnected to a control chip, the TFT array substrate includes:

a flexible substrate includes a metal jumper-joint sublayer disposed inthe non-display area, the metal jumper-joint sublayer adjacent to thedisplay area; and

a thin film transistor layer is disposed on the flexible substrate, andthe thin film transistor layer includes a plurality of thin filmtransistors correspondingly disposed in the display area, a gate traceof each of the thin film transistors and a gate trace of the non-displayarea are connected by a jumper joint arrangement through the metaljumper-joint sublayer.

According to one embodiment of the present disclosure, the flexiblesubstrate includes a first flexible sublayer, an inorganic sublayer, themetal jumper-joint sublayer, and a second flexible sublayer stacked insequence.

According to one embodiment of the present disclosure, the metaljumper-joint sublayer includes a first titanium metal sublayer, analuminum metal sublayer, and a second titanium metal sublayer stacked insequence.

According to one embodiment of the present disclosure, the metaljumper-joint sublayer is correspondingly disposed in a bending area ofthe non-display area.

According to one embodiment of the present disclosure, the secondflexible sublayer is provided with a first through hole and a secondthrough hole, the first through hole is used for connecting the gatetrace of the thin film transistor to the metal jumper-joint sublayer,and the second through hole is used for connecting the gate trace of thenon-display area to the metal jumper-joint sublayer.

According to one embodiment of the present disclosure, the thin filmtransistor layer includes a TFT active area, a gate insulation sublayer,the gate traces, an interlayer dielectric sublayer, and a plurality ofsource/drain traces stacked in sequence, the gate insulation sublayer isprovided with a third through hole at a position corresponding to themetal jumper-joint sublayer, and the third through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer.

According to one embodiment of the present disclosure, the TFT arraysubstrate further includes a buffer layer disposed between the flexiblesubstrate and the thin film transistor layer, the buffer layer isprovided with a fourth through hole at a position corresponding to themetal jumper-joint sublayer, and the fourth through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer.

The present disclosure further provides an organic light emitting diode(OLED) panel, including:

a thin film transistor (TFT) array substrate including a display areaand a non-display area, wherein the non-display area is provided with aplurality of gate traces connected to a control chip, the TFT arraysubstrate includes a flexible substrate and a thin film transistorlayer, the flexible substrate includes a metal jumper-joint sublayerdisposed in the non-display area, the metal jumper-joint sublayer isadjacent to the display area, the thin film transistor layer is disposedon the flexible substrate, and the thin film transistor layer includes aplurality of thin film transistors correspondingly disposed in thedisplay area, a gate trace of each of the thin film transistors and agate trace of the non-display area are connected by a jumper jointarrangement through the metal jumper-joint sublayer;

an organic electroluminescent device layer is disposed on the thin filmtransistor layer and located in the display area; and

an encapsulation layer is disposed on the organic electroluminescentdevice layer.

According to one embodiment of the present disclosure, the flexiblesubstrate includes a first flexible sublayer, an inorganic sublayer, themetal jumper-joint sublayer, and a second flexible sublayer stacked insequence.

According to one embodiment of the present disclosure, the metaljumper-joint sublayer is correspondingly disposed in a bending area ofthe non-display area.

Beneficial Effect

Since the gate trace of each of the thin film transistors and the gatetrace of the non-display area are connected by a jumper jointarrangement through the metal jumper-joint sublayer, the metaljumper-joint sublayer can be disposed in the bending area to prevent thegate trace from breaks upon being bent, thereby reducing the length ofthe lower bezel of the OLED panel.

DESCRIPTION OF DRAWINGS

In order to make the above content of the present disclosure morecomprehensible, the preferred embodiments are described as follows indetail with the accompanying drawings:

FIG. 1 is a schematic diagram of a circuit configuration of an existingorganic light emitting diode (OLED) panel.

FIG. 2 is a schematic diagram of a circuit configuration of an OLEDpanel according to one embodiment of the present disclosure.

FIG. 3 is a structural cross-section view of the embodiment in FIG. 2.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In the following detailed description of the preferred embodiments,reference is made to the accompanying drawings which form a part hereof,and in which is shown by way of illustrating specific embodiments inwhich the disclosure may be practiced. In this regard, directionalterminology, such as “top”, “bottom”, “front”, “back”, “left”, “right”,“inside”, “outside”, “side”, etc., is used with reference to theorientation of the figure(s) being described. As such, the directionalterminology is used for purposes of illustration and is in no waylimiting.

Please refer to FIG. 2 and FIG. 3. FIG. 2 is a schematic diagram of acircuit configuration of an OLED panel according to one embodiment ofthe present disclosure. FIG. 3 is a structural cross-section view of theembodiment in FIG. 2. An OLED panel of the embodiment includes a thinfilm transistor (TFT) array substrate 100, an organic electroluminescentdevice layer 200, and an encapsulation layer 300. The organicelectroluminescent device layer 200 is disposed on the TFT arraysubstrate 100, and the encapsulation layer 300 is disposed on theorganic electroluminescent device layer 200.

As shown in FIG. 2, the TFT array substrate 100 includes a bezel 21, adisplay area 22, and a non-display area 22 a. The non-display area 22 ais provided with a plurality of gate traces connected to a control chip26 a. Taking FIG. 2 as an example, the non-display area 22 a may includea bending area 23, and the non-display area 22 a may further include aninterface area 26 for connecting to the control chip 26 a, VDD traces24, and VSS traces 25.

As shown in FIG. 3, the TFT array substrate 100 includes a flexiblesubstrate 110 and a thin film transistor layer 120. The flexiblesubstrate 110 includes a first flexible sublayer 111, an inorganicsublayer 112, a metal jumper-joint sublayer 113, and a second flexiblesublayer 114 stacked in sequence. The first flexible sublayer 111 andthe second flexible sublayer 114 may be made of flexible polymermaterials, such as polyimide (PI). The metal jumper-joint sublayer 113is disposed in the bending area 23 of the non-display area 22 a, and themetal jumper-joint sublayer 113 is adjacent to the display area 2. Inaddition, the metal jumper-joint sublayer 113 includes a first titaniummetal sublayer, an aluminum metal sublayer, and a second titanium metalsublayer stacked in sequence. The structure using titaniummetal/aluminum metal/titanium metal has a desirable ductility, so thatthe metal jumper-joint sublayer 113 is easily bent, thereby furtherreducing the lower bezel of the OLED panel. The second flexible sublayer114 is provided with a first through hole and a second through hole, thefirst through hole is used for connecting the gate trace 142 of the thinfilm transistor to the metal jumper-joint sublayer 113, and the secondthrough hole is used for connecting the gate trace 144 of thenon-display area 22 a to the metal jumper-joint sublayer 113.

The thin film transistor layer 120 is disposed on the flexible substrate110, and the thin film transistor layer 120 includes a plurality of thinfilm transistors 120A, 120B correspondingly disposed in the displayarea, wherein a gate trace of each of the thin film transistors 120A,120B and the gate trace 144 of the non-display area 22 a are connectedby a jumper joint arrangement through the metal jumper-joint sublayer113.

The thin film transistor layer 120 includes a TFT active area 121, agate insulation sublayer 130, the gate traces 142, an interlayerdielectric sublayer 150, and a source/drain layer 160 stacked insequence, the gate insulation sublayer 130 is provided with a thirdthrough hole at a position corresponding to the metal jumper-jointsublayer 113, and the third through hole is used for connecting the gatetrace 144 of the thin film transistor to the metal jumper-joint sublayer113.

In addition, the TFT array substrate 100 further includes a buffer layer115 disposed between the flexible substrate 110 and the thin filmtransistor layer 120, the buffer layer 115 is provided with a fourththrough hole at a position corresponding to the metal jumper-jointsublayer 113, and the fourth through hole is used for connecting thegate trace 144 of the thin film transistor to the metal jumper-jointsublayer 113.

The organic electroluminescent device layer 200 is disposed on the thinfilm transistor layer 110 and located in the display area 2. The organicelectroluminescent device layer 200 includes a first electrode 210, asecond electrode 220, and an electroluminescent layer 230, wherein theelectroluminescent layer 230 is disposed between the first electrode 210and the second electrode 220.

The encapsulation layer 300 is disposed on the organicelectroluminescent device layer 200. The encapsulation layer 300includes a first inorganic encapsulation layer 310, an organicencapsulation layer 320, and a second inorganic encapsulation layer 330.

Taking FIG. 3 as an example to explain in more detail, the inorganicsublayer 112 is disposed on the first flexible sublayer 111. The metaljumper-joint sublayer 113 is disposed on the inorganic sublayer 112, andthe metal jumper-joint sublayer 113 is disposed in the bending area 23of the non-display area 22 a (that is, the jumper-joint position 27 inFIG. 2). The second flexible sublayer 114 is disposed on the metaljumper-joint sublayer 113 and the inorganic sublayer 112. The bufferlayer 115 is disposed on the second flexible sublayer 114.

The thin film transistor layer 120 is disposed on the buffer layer 115.The interlayer dielectric sublayer 150 of the thin film transistor layer120 is disposed between a gate metal layer 140 and the source/drainlayer 160. The gate metal layer 140 includes at least one gate electrode142 and at least one gate traces 144 in the non-display area 22 a. Thegate electrode 142 is located in the display area 2. The gate trace 144is connected to the gate traces in the display area (not shown). Thegate trace of the display area is electrically connected to the metaljumper-joint sublayer 113 through a conductive via 135 before the gatetrace of the display area enters the bending area 23. The metaljumper-joint sublayer 113 is electrically connected to the gate trace144 in the non-display area 22 a through a conductive via (not shown)after passing through the bending area 23. In this way, when the gatetrace passes through the bending region 23, the metal jumper-jointsublayer 113 with desirable bending performance is used to achieveelectrical connection, to prevent the gate trace form breaks when thebending region 23 is bent. The conductive via 135 may be formed by thesecond through hole, the third through hole, and the fourth throughhole. That is, the conductive via 135 is formed by depositing metal inthe second through hole, the third through hole, and the fourth throughhole, which are corresponding to each other. The source/drain layer 160includes at least one source electrode 160, at least one drain electrode164, and at least one source/drain trace 166. The source electrode 162,the drain electrode 164, and the corresponding gate electrode 142 areconnected through an interlayer dielectric sublayer conductive hole 155to form the thin film transistor (such as, 120A, 120B). The thin filmtransistor 120A, 120B are located in the display area 2.

In addition, a planarization layer 170 and a pixel definition layer 180may be provided between the thin film transistor layer 110 and theorganic electroluminescent device layer 200. The planarization layer 170is disposed on the source/drain layer 160. The pixel definition layer180 is disposed on the planarization layer 170.

Due to the gate traces are connected by a jumper joint arrangementthrough the metal jumper-joint sublayer, the jumper-joint position 27 inthe embodiment of the present disclosure can be located adjacent to thedisplay area 22 (please refer to FIG. 1 and FIG. 2). Therefore, thepresent disclosure can further reduce the length of the lower bezel ofthe OLED panel.

Furthermore, the OLED panel further includes a retaining wall 190located in the non-display area 22 a. The retaining wall 190 is formedby the planarization layer 170 and the pixel definition layer 180. Theretaining wall 190 may further includes the first inorganicencapsulation layer 310 and the second inorganic encapsulation layer 330stacked in sequence.

The beneficial effect of the present disclosure is described as follow.Since the gate trace of each of the thin film transistors and the gatetrace of the non-display area 22 a are connected by the jumper jointarrangement through the metal jumper-joint sublayer, the metaljumper-joint sublayer can be disposed in the bending area to prevent thegate trace from breaks upon being bent, thereby reducing the length ofthe lower bezel of the OLED panel.

In view of the above, although the present invention has been disclosedby way of preferred embodiments, the above preferred embodiments are notintended to limit the present invention, and one of ordinary skill inthe art, without departing from the spirit and scope of the invention,the scope of protection of the present invention is defined by the scopeof the claims.

What is claimed is:
 1. An organic light emitting diode (OLED) panel,comprising: a thin film transistor (TFT) array substrate comprising adisplay area and a non-display area, wherein the non-display area isprovided with a plurality of gate traces connected to a control chip,the TFT array substrate includes a flexible substrate and a thin filmtransistor layer, the flexible substrate includes a metal jumper-jointsublayer disposed in the non-display area, the metal jumper-jointsublayer is adjacent to the display area, the thin film transistor layeris disposed on the flexible substrate, and the thin film transistorlayer includes a plurality of thin film transistors correspondinglydisposed in the display area, a gate trace of each of the thin filmtransistors and a gate trace of the non-display area are connected by ajumper joint arrangement through the metal jumper-joint sublayer, theflexible substrate includes a first flexible sublayer, an inorganicsublayer, the metal jumper-joint sublayer, and a second flexiblesublayer stacked in sequence; a planarization layer is disposed on thethin film transistor layer; a pixel definition layer is disposed on theplanarization layer; an organic electroluminescent device layer isdisposed on the pixel definition layer and located in the display area;and an encapsulation layer is disposed on the organic electroluminescentdevice layer.
 2. The OLED panel according to claim 1, wherein the metaljumper-joint sublayer comprises a first titanium metal sublayer, analuminum metal sublayer, and a second titanium metal sublayer stacked insequence.
 3. The OLED panel according to claim 1, wherein the metaljumper-joint sublayer is correspondingly disposed in a bending area ofthe non-display area.
 4. The OLED panel according to claim 1, whereinthe second flexible sublayer is provided with a first through hole and asecond through hole, the first through hole is used for connecting thegate trace of the thin film transistor to the metal jumper-jointsublayer, and the second through hole is used for connecting the gatetrace of the non-display area to the metal jumper-joint sublayer.
 5. TheOLED panel according to claim 1, wherein the thin film transistor layercomprises a TFT active area, a gate insulation sublayer, the gatetraces, an interlayer dielectric sublayer, and a plurality ofsource/drain traces stacked in sequence, the gate insulation sublayer isprovided with a third through hole at a position corresponding to themetal jumper-joint sublayer, and the third through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer.
 6. The OLED panel according to claim 1, whereinthe TFT array substrate further comprises a buffer layer disposedbetween the flexible substrate and the thin film transistor layer, thebuffer layer is provided with a fourth through hole at a positioncorresponding to the metal jumper-joint sublayer, and the fourth throughhole is used for connecting the gate trace of the thin film transistorto the metal jumper-joint sublayer.
 7. The OLED panel according to claim1, wherein the encapsulation layer comprises a first inorganicencapsulation layer, an organic encapsulation layer, and a secondinorganic encapsulation layer.
 8. A thin film transistor (TFT) arraysubstrate, comprising a display area and a non-display area, wherein thenon-display area is provided with a plurality of gate traces connectedto a control chip, the TFT array substrate includes: a flexiblesubstrate includes a metal jumper-joint sublayer disposed in thenon-display area, the metal jumper-joint sublayer adjacent to thedisplay area; and a thin film transistor layer is disposed on theflexible substrate, and the thin film transistor layer includes aplurality of thin film transistors correspondingly disposed in thedisplay area, a gate trace of each of the thin film transistors and agate trace of the non-display area are connected by a jumper jointarrangement through the metal jumper-joint sublayer.
 9. The TFT arraysubstrate according to claim 8, wherein the flexible substrate comprisesa first flexible sublayer, an inorganic sublayer, the metal jumper-jointsublayer, and a second flexible sublayer stacked in sequence.
 10. TheTFT array substrate according to claim 9, wherein the metal jumper-jointsublayer comprises a first titanium metal sublayer, an aluminum metalsublayer, and a second titanium metal sublayer stacked in sequence. 11.The TFT array substrate according to claim 9, wherein the metaljumper-joint sublayer is correspondingly disposed in a bending area ofthe non-display area.
 12. The TFT array substrate according to claim 9,wherein the second flexible sublayer is provided with a first throughhole and a second through hole, the first through hole is used forconnecting the gate trace of the thin film transistor to the metaljumper-joint sublayer, and the second through hole is used forconnecting the gate trace of the non-display area to the metaljumper-joint sublayer.
 13. The TFT array substrate according to claim 8,wherein the thin film transistor layer comprises a TFT active area, agate insulation sublayer, the gate traces, an interlayer dielectricsublayer, and a plurality of source/drain traces stacked in sequence,the gate insulation sublayer is provided with a third through hole at aposition corresponding to the metal jumper-joint sublayer, and the thirdthrough hole is used for connecting the gate trace of the thin filmtransistor to the metal jumper-joint sublayer.
 14. The TFT arraysubstrate according to claim 13, wherein the TFT array substrate furthercomprises a buffer layer disposed between the flexible substrate and thethin film transistor layer, the buffer layer is provided with a fourththrough hole at a position corresponding to the metal jumper-jointsublayer, and the fourth through hole is used for connecting the gatetrace of the thin film transistor to the metal jumper-joint sublayer.15. An organic light emitting diode (OLED) panel, comprising: a thinfilm transistor (TFT) array substrate comprising a display area and anon-display area, wherein the non-display area is provided with aplurality of gate traces connected to a control chip, the TFT arraysubstrate includes a flexible substrate and a thin film transistorlayer, the flexible substrate includes a metal jumper-joint sublayerdisposed in the non-display area, the metal jumper-joint sublayer isadjacent to the display area, the thin film transistor layer is disposedon the flexible substrate, and the thin film transistor layer includes aplurality of thin film transistors correspondingly disposed in thedisplay area, a gate trace of each of the thin film transistors and agate trace of the non-display area are connected by a jumper jointarrangement through the metal jumper-joint sublayer; an organicelectroluminescent device layer is disposed on the thin film transistorlayer and located in the display area; and an encapsulation layer isdisposed on the organic electroluminescent device layer.
 16. The OLEDpanel according to claim 15, wherein the flexible substrate comprises afirst flexible sublayer, an inorganic sublayer, the metal jumper-jointsublayer, and a second flexible sublayer stacked in sequence.
 17. TheOLED panel according to claim 16, wherein the metal jumper-jointsublayer is correspondingly disposed in a bending area of thenon-display area.